Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1993-12-20
1995-01-24
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
257678, 257686, 361728, 361790, 361792, 361807, H05K 118
Patent
active
053846893
ABSTRACT:
An integrated circuit chip includes a printed circuit board unit, a die and a plurality of conductive wires. The printed circuit board unit has a top surface, a plurality of conductive strips that is provided on the top surface, and a die-receiving cavity that is formed therewith. The cavity is accessible via the top surface. The die has an upper surface and a plurality of solder pads that is formed on the upper surface. The die is received in the die-receiving cavity of the printed circuit board unit such that the solder pads are exposed at the top surface of the printed circuit board unit. The conductive wires interconnect the solder pads of the die and the conductive strips of the printed circuit board unit.
REFERENCES:
patent: 4288841 (1981-09-01), Gogal
patent: 4996587 (1991-02-01), Hinrichsmeyer et al.
patent: 5128831 (1992-07-01), Fox, III et al.
patent: 5205032 (1993-04-01), Kuroda et al.
patent: 5231305 (1993-07-01), Russell
Research Disclosure "Organic Card Device Carrier" No. 313 May 1990.
Picard Leo P.
Sparks Donald A.
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