Multi-layer lead frames for integrated circuit packages

Details Multi-layer lead frames for integrated circuit packages Multi-layer lead frames for integrated circuit packages

1989-10-30

1991-06-18

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 70, 357 74, H01L 2302

Patent

active

050251147

ABSTRACT:
A composite leadframe is provided. The leadframe comprises a rigid metal portion electrically interconnected to a flexible multi-layer portion. When sealed within an electronic package, the composite leadframe provides a higher lead density than achieved by rigid metal leadframes and better electrical and mechanical properties than achieved with flexible leads. The package may comprise a discrete base and cover component with the leadframe disposed between or a monolithic block of plastic encapsulating the electronic device and a portion of the leadframe.

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"Introducing Intel's MM Multi-Layer Molded High Performance, PQFP, 1989", Section 2.

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