Resin-sealed type ball grid array IC package and manufacturing m

Details Resin-sealed type ball grid array IC package and manufacturing m Resin-sealed type ball grid array IC package and manufacturing m

1998-10-05

2000-01-11

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361740, 361761, 361767, 361768, 257667, 257787, 174 524, 174255, 174260, 438115, 438126, 438127, 26427217, H01L 23043

Patent

active

060143185

ABSTRACT:
An IC package suitable for high density mounting and high speed is provided, by improving the humidity resistance and mounting stress resistance at a resin-sealed type BGA package and improving the reliability lessened a warp of the package. A concave part is provided in a multi-layer wiring substrate which has an exhaling route of water vapor expanded by heat in the inside of the package and a semiconductor chip is mounted at the concave part and is connected electrically to the substrate and the upper surface and sides of the package is sealed with resin. By this constitution, the infiltration of water is prevented and the stress at receiving thermal stress is lessened and the occurrence of stripping and crack of the inside of the package is prevented. Moreover, by utilizing the concave part effectively and connecting electrically, the wiring length is shortened and the high frequency characteristic is improved.

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