Metal fusion bonding – Process – Repairing – restoring – or renewing product for reuse
Patent
1998-02-03
2000-01-11
Heinrich, Samuel M.
Metal fusion bonding
Process
Repairing, restoring, or renewing product for reuse
228119, 2281801, 228223, 2282341, 228207, A01K 6300
Patent
active
060126248
ABSTRACT:
A tool for soldering pin-in-hole electronic circuit components includes a tool plate with a set of via holes corresponding to the holes of a circuit board on which a circuit component is soldered. The board is aligned with the tool plate and hot gas is supplied through the set of plate vias to reflow solder in the board holes. The tool is particularly suitable for use in removing and replacing pinned circuit components. Use of particular gases (e.g., nitrogen) allows soldering to be carried out without the use of flux. Advantages of the tool are that it prevents burning the circuit board and/or unintentionally reflowing other circuit components mounted on the board (by directing hot gas only substantially onto the circuit board's solder-containing holes).
REFERENCES:
patent: 4561584 (1985-12-01), Hug
patent: 4847465 (1989-07-01), Toyama et al.
patent: 5222655 (1993-06-01), Moretti et al.
patent: 5878941 (1999-03-01), Backer et al.
French William
Lees Stuart
McCall Colin David
Murray Kenneth Skene
Robertson Brian
Fraley Lawrence R.
Heinrich Samuel M.
International Business Machines - Corporation
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