Manufacturing method for electric field emission element using u

Details Manufacturing method for electric field emission element using u Manufacturing method for electric field emission element using u

1998-02-03

1999-11-09

Bowers, Charles

Semiconductor device manufacturing: process

Electron emitter manufacture

257 10, H01L 2100

Patent

active

059813059

ABSTRACT:
A method for manufacturing field emission elements having sharp convex points (tips) that uses a mold concavity having a sharp concavity point (cusp) comprises the steps of preparing a substrate having an opening at least in its front surface, depositing a sacrificial film on the substrate, to form a mold concavity having a sharp concavity point in the opening, forming a film made up of electrically conducting ultra fine particles on the sacrificial film, to bury the mold opening and removing at least that portion of the sacrificial film that is at the concavity point. A method for manufacturing field emission elements with sharp convex points is provided, wherewith emitter material can easily be packed into a mold concavity having a sharp cusp.

REFERENCES:
patent: 5334908 (1994-08-01), Zimmerman
patent: 5529524 (1996-06-01), Jones
M. Oda, et al., "Dry and Direct Drawing System Using Ultra Fine Particles", Denshi, Zairyo, Oct. 1994, pp. 1-9.
M. Oda, et al., "Ultra Fine Particle Conductive Paste for Low Firing Temperature Use", Low Temperature Sintered Paste Using Ultra Fine Particles, SMH Magazine, vol. 11, No. 1, pp. 28-32.
"Novel Thin Film Formation Using Ultra Fine Particles", Ulvac Technical Journal, No. 40, 1993, pp. 14-20.
R. Uyeda, "Studies of Ultrafine Particles in Japan: Crystallography. Methods of Preparation and Technological Applications", Progress in Materials Science, vol. 35, 1991, pp. 1-96.

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