Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1996-03-12
1998-12-15
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
134 11, 134 12, H05H 100
Patent
active
058491350
ABSTRACT:
Particulate contamination removal from wafers using plasmas and mechanical agitation. The present invention includes the use of plasmas with mechanical agitation for removing particulate matter from the surface of a wafer. The apparatus hereof comprises a mechanical activator, at least one conducting contact pin for transferring the vibration from the activator to the wafer, clamp fingers that maintain the wafer's position, and means for generating a plasma in the vicinity of the surface of the wafer, all parts of the cleaning apparatus except the mechanical activator and part of the contact pin being contained inside the processing chamber. By exposing a wafer to a plasma and providing motion thereto in a direction perpendicular to its surface, the bonding between the particulate matter and the surface may be overcome. Once free of the wafer surface, the particulates become charged by electrons from the plasma and are drawn into the plasma by attractive forces which keep them from redepositing. The introduction of a flowing gas through the plasma sweeps the particulates away from the wafer and out of the plasma. The entire surface is cleaned during one cleaning step. The use of an rf plasma to accomplish the particulate removal was found to remove more than 90% of the particulates.
REFERENCES:
patent: 5298720 (1994-03-01), Cuomo
patent: 5387777 (1995-02-01), Bennett et al.
patent: 5531862 (1996-07-01), Otsubo et al.
John Goree and G.S. Selwyn, "Dusty Plasmas in the Cosmos and in Chip Manufacture," Physics News in 1994 (eds. Phillip F. Schewe and Ben P. Stein, American Institute of Physics, College Park, MD), pp. 59-61 (1994).
Anatolii D. Zimon, Adhesion of Dust and Powder (Plenum Press, New York, 1969), pp. 181-183.
J. Goree, "Charging of Particles In a Plasma," Plasma Sources Sci. & Techno., 3,400 (1994).
Gary S. Selwyn, . "A Phenomenlogical Study of Particulates In Plasma Tools and Processes," Jpn. J. Appl. Phys. 32, 3068 (1993).
Gary S. Selwyn, "Pump/Purge Procedure Using Neon Feedstock," IBM Technical Disclosure Bull., 34, 237 (1992).
Gary S. Selwyn, "Plasma Particulate Contamination Control: 1. Transport and Process Effects," J. Vac. Sci. Technol. B 9 (6), 3487 (1991).
Dang Thi
Freund Samuel M.
The Regents of the University of California
LandOfFree
Particulate contamination removal from wafers using plasmas and does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Particulate contamination removal from wafers using plasmas and , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Particulate contamination removal from wafers using plasmas and will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1454264