Molding apparatus for minimizing shrinkage and voids

Metal founding – Means to shape metallic material – Pressure shaping means

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Details

164133, 164335, B22D 1712, B22D 1720, B22D 1730

Patent

active

057587116

ABSTRACT:
The apparatus which pushes or elevates molten material into a mold cavity. The apparatus further includes a reservoir and a shuttle for transferring the molten material from a reservoir. The shuttle and reservoir assembly permits molten material to be elevated upwardly into the shuttle from the beneath the surface of the molten material to minimize or eliminate pouring and thus turbulence and pores in the final product. The final product is free of cracks and laminations, and is smooth and nonporous.

REFERENCES:
patent: 1326936 (1920-01-01), Jeans et al.
patent: 2500556 (1950-03-01), Mallach
patent: 2510100 (1950-06-01), Goss
patent: 3344848 (1967-10-01), Hall et al.
patent: 3534802 (1970-10-01), Carr
patent: 3554272 (1971-01-01), Lauth
patent: 3945428 (1976-03-01), Yanagisawa et al.
patent: 4049040 (1977-09-01), Lynch
patent: 4266597 (1981-05-01), Eberle
patent: 4505307 (1985-03-01), Uchida
patent: 4592405 (1986-06-01), Allen
patent: 4779665 (1988-10-01), Ouimet
patent: 5072772 (1991-12-01), Haehne
patent: 5074352 (1991-12-01), Suzuki
patent: 5143141 (1992-09-01), Frulla
patent: 5170835 (1992-12-01), Eberle et al.
patent: 5343927 (1994-09-01), Ivansson
Lindberg Corporation, Press Release: Thixomolding.TM. Processes Establishes Production Benchmarks, 1993, Five pages, Illinois.
Lindberg Corporation, Hot Lines, date unknown, Issue 3, three pages, place of publication unknown.
HPM Corporation, HPM Tech Data--Thixomolding, Feb., 1992, one page, place of publication unknown.
HPM, Thixomolding Utilizes Injection Molding . . . , date unknown, 2 page advertisement, place of publication unknown.
Lindberg Corporation, Hot Lines, Mar. 1993, vol. III, Issue 2, pp. 1-2, place of publication unknown.

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