Electronic packaging of components incorporating a ceramic-glass

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Including a second component containing structurally defined...

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428328, 428426, 428428, 428432, 428433, 428688, 428901, 361403, 361411, 156 85, B32B 900

Patent

active

050248839

ABSTRACT:
The present invention is directed to components and the process of forming the components for housing semiconductor devices. The components are formed of a unique ceramic-glass-metal composite material comprising ceramic particles, metallic particles and a glass matrix with said ceramic and metallic particles dispersed throughout. Metal elements can be embedded into the material to enable simplified fabrication of devices such as semiconductor packaging.

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