Method of bonding columbium to nickel and nickel based alloys us

Details Method of bonding columbium to nickel and nickel based alloys us Method of bonding columbium to nickel and nickel based alloys us

1986-10-16

1987-11-17

Ramsey, Kenneth J.

Metal fusion bonding

Process

Diffusion type

22826319, B23K 104, B23K 3532

Patent

active

047068728

ABSTRACT:
The disclosure relates to a method of joining nickel and nickel based alloys to columbium at low pressure and low temperature, wherein a thin titanium brazing foil is provided, with or without a copper coating electroplated thereon. The layers or foils of the metals to be joined are placed in intimate contact with opposite sides of the brazing foil under pressure and heated in a vacuum to a temperature above the eutectic of the metals being used and below 2000.degree. F. and preferably below 1950.degree. F. to provide the bond.

REFERENCES:
patent: 3046650 (1962-07-01), Heestand
patent: 3170234 (1965-02-01), Tarr
patent: 3214833 (1965-11-01), Erickson
patent: 3290773 (1966-12-01), Wohlberg et al.
patent: 3309767 (1967-03-01), Sama
patent: 3317288 (1967-05-01), Marshall
patent: 3594895 (1971-07-01), Hill
patent: 4034454 (1977-07-01), Galasso et al.
patent: 4448853 (1984-05-01), Fischer et al.

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