Laterally stacked Schottky diodes for infrared sensor applicatio

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357 15, 357 67S, 357 71S, H01L 2714

Patent

active

049909886

ABSTRACT:
Laterally stacked Schottky diodes (25) for infrared sensor applications are fabricated utilizing porous silicon (10) having pores (12). A Schottky metal contact (24) is formed in the pores, such as by electroplating. The sensors may be integrated with silicon circuits on the same chip with a high quantum efficiency, which is ideal for IR focal plane array applications due to uniformity and reproducibility.

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