Micro-emitter-based low-contact-force interconnection device

Details Micro-emitter-based low-contact-force interconnection device Micro-emitter-based low-contact-force interconnection device

1992-08-18

1993-06-22

Ramsey, Kenneth J.

Metal working

Method of mechanical manufacture

Electrical device making

29884, 29885, 445 50, 156657, 1566591, 156664, H01R 4316

Patent

active

052207250

ABSTRACT:
An interconnection device is disclosed for providing electrical connection between two conducting elements that requires less applied force than a standard ohmic connection device of the same connection area. A surface of at least a first conducting element includes a plurality of atomically sharp projections for creating a strong electric field near the tip of each projection, each projection being disposed within a locally depressed portion of an insulating layer that serves to maintain a space between each tip and a second conducting element that contacts the insulating layer. The strong electric field at each tip induces a variety of conduction modes each contributing to an aggregate current flow from the first conducting element to the second. In an alternate embodiment, a plurality of projections are disposed on the peaks and valleys of a rough surface without an insulating layer, the projections providing a variety of conduction modes.

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