Process for preparing multi-layer printed wiring board

Details Process for preparing multi-layer printed wiring board Process for preparing multi-layer printed wiring board

1991-11-04

1993-06-22

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

156902, H05K 336

Patent

active

052207234

ABSTRACT:
Disclosed is a process for preparing a multi-layer printed wiring board including the step of forming a through hole and an external layer circuit on a laminated board of double-sided or multi-layer construction. Then the laminated board is coated over the whole front and back surfaces with a paste-like heat-resistant resin, simultaneously filling the through hole with a resin. A copper foil is disposed on the whole front and back surfaces of the laminated board. Next, the arrangement is heated and pressure-molded in a vacuum. The copper foil is then removed to form an intermediate laminated board. Then, multilayer molding of at least two sets of intermediate laminated boards with a prepreg interposed therebetween is preformed via a step of heat and pressure-molding. In using the penetrated through hole as the divided via hole, there is no longer a restriction of the thickness of the respective divided via holes on the same lattice point. Thus, it has become possible to use the via holes in a higher multilayer board, dramatically improving wiring capacity over the prior art divided via holes.

REFERENCES:
patent: 3867759 (1975-02-01), Siefker
patent: 4496793 (1985-01-01), Hanson et al.
patent: 4780957 (1988-11-01), Shiga et al.
patent: 4817280 (1989-04-01), Ozaki
patent: 4854038 (1989-08-01), Wiley
patent: 4864722 (1989-09-01), Lazzarini et al.
patent: 4868350 (1989-09-01), Hoffarth

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