Semiconductor chip mounting system

Details Semiconductor chip mounting system Semiconductor chip mounting system

1986-03-11

1988-04-12

James, Andrew J.

357 71, 357 74, 357 81, 357 82, H01L 2354, H01L 2310, H01L 2312

Patent

active

047378395

ABSTRACT:
A semiconductor chip module with a flat mounting surface is disclosed. A wafer-scale silicon semiconductor chip is provided with electronic circuits formed therein. The chip has a metallized back face and contacts on the opposite, front face. A solder layer secures the metallized back face of the chip to the mounting surface substantially without voids.

REFERENCES:
patent: 3633076 (1972-01-01), Arndt
patent: 3706015 (1972-12-01), Schimmer et al.
patent: 3746944 (1973-07-01), Naroaka et al.
patent: 4176443 (1979-12-01), Iannzzi et al.
patent: 4480261 (1984-10-01), Hattori et al.
"Silicides for Interconnection Technology"-Solid State Technology-Author-Farrokh Mohammed-Jan.-1981, pp. 65-72.

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