Low shrinkling curable poly(acrylate) molding compositions

Details Low shrinkling curable poly(acrylate) molding compositions Low shrinkling curable poly(acrylate) molding compositions

1983-05-26

1986-04-29

Bleutge, John C.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525265, 525281, 525285, 525286, 525293, 525296, 525301, 525303, 525305, 525306, C08F 404, C08F 434, C08F 438

Patent

active

045858330

ABSTRACT:
This invention is directed to curable molding compositions containing a mixture of a poly(acrylate), a polymerizable ethylenically unsaturated monomer which serves to crosslink the poly(acrylate) to a thermoset product, a thermoplastic polymer low profile additive, and a free radical initiator mixture containing at least one initiator with a 10-hour half-life temperature (t.sub.1/2) of greater than about 90.degree. C. and at least one initiator with a 10-hour half-life temperature (t.sub.1/2) of less than about 90.degree. C. The curable molding compositions exhibit improved shrink control during the curing reaction. This invention is also directed to fiber reinforced thermoset resin articles which exhibit generally improved surface appearance quality and can be produced by a rapid injection molding process from the curable molding compositions.

REFERENCES:
patent: 3789051 (1974-01-01), Rees et al.
patent: 4327013 (1982-04-01), Peters
U.S. patent application Ser. No. 279,448, filed Jul. 1, 1981.
U.S. patent application Ser. No. 278,902, filed Jun. 29, 1981.
U.S. patent application Ser. No. 279,450, filed Jul. 1, 1981.
U.S. patent appliecation Ser. No. 279,446, filed Jul. 1, 1981.
U.S. patent application Ser. No. 135,906, filed Apr. 14, 1980.

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