Method of producing a piezoelectric/electrostrictive film elemen

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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156 8916, 264618, 264681, 310324, 427100, C04B 3700, H01L 4108

Patent

active

058535144

ABSTRACT:
A method of producing a piezoelectric/electrostrictive film element is disclosed. The film element includes a zirconia substrate having a window which is closed by a diaphragm portion, and a piezoelectric or electrostrictive unit formed on the substrate and including a piezoelectric or electrostrictive layer between upper and lower electrodes. The method comprises the steps of: (a) preparing the substrate which has been sintered and in which at least the diaphragm portion contains alumina in an amount of 1.1-5.0 parts by weight; (b) forming, by a film-forming process, the lower electrode on the diaphragm portion, and the piezoelectric/electrostrictive layer on the lower electrode by using a piezoelectric/electrostrictive material which contains magnesia or a component which gives magnesia, in an independent form or in a compound form; and (c) firing the piezoelectric/electrostrictive layer, so as to deposit particles consisting principally of a compound of alumina and magnesia at least on an interface between the diaphragm portion and the lower electrode, the interface being located right under the piezoelectric/electrostrictive layer.

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