Polishing pad and polishing apparatus having the same

Abrading – Machine – Rotary tool

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

451287, 451530, 451533, 451527, 451526, 451921, 451 41, 451548, 451550, 451446, B24B 2900

Patent

active

058533176

ABSTRACT:
A polishing pad made of a flexible material includes a first major surface, a second major surface, and a large number of holes. The first major surface is urged by a rotatable polishing target member to polish a polishing target surface of the urged polishing target member by using a slurry. The second major surface is adhered to a rotatable platen. The large number of holes extend between the first and second major surfaces and serve as slurry reservoirs. The holes have a larger opening area on the second major surface than that on the first major surface. A polishing apparatus is also disclosed.

REFERENCES:
patent: 4490948 (1985-01-01), Hanstein et al.
patent: 4841680 (1989-06-01), Hoffstein et al.
patent: 5533923 (1996-07-01), Shamouillian et al.
patent: 5658185 (1997-08-01), Morgan, III et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Polishing pad and polishing apparatus having the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polishing pad and polishing apparatus having the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing pad and polishing apparatus having the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1418404

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.