Sealing press for automated assembly apparatus

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Plural discrete workpieces

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Details

228 441A, 228 49, 228 47, 29588, 29742, 29743, 65155, 425444, H01L 2152

Patent

active

041024818

ABSTRACT:
Sealing apparatus for the automatic assembly of integrated circuit packages. The semiconductor device package is comprised of an upper and lower ceramic cover, and a metal lead frame having mounted thereon the integrated circuit. The automatic ceramic sealing apparatus provides a good quality hermetic seal of the integrated circuit within the ceramic covers by including continuously heated sealing presses mounted on a rotary dial table.

REFERENCES:
patent: 3382342 (1968-05-01), Dix et al.
patent: 3436201 (1969-04-01), Tsuji et al.
patent: 3551127 (1970-12-01), Stoll
patent: 3696986 (1972-10-01), Anderson et al.
patent: 3711939 (1973-01-01), Stoll

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