Semiconductor device having particular solder interconnection ar

Details Semiconductor device having particular solder interconnection ar Semiconductor device having particular solder interconnection ar

1991-10-10

1993-01-26

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257779, 257783, H01L 2354, H01L 2334

Patent

active

051826283

ABSTRACT:
A semiconductor device which is resistant to cracking during a heat cycle is provided which uses a lead-tin alloy solder having a weight ratio in a range of 45/55 to 55/45 to bond an insulation plate and a heat sink plate of the semiconductor device to one another.

REFERENCES:
patent: 4278990 (1981-07-01), Fichot
patent: 4470063 (1984-09-01), Arakawa et al.
patent: 4486511 (1984-12-01), Chen et al.
patent: 4677741 (1987-07-01), Takahama
patent: 4796157 (1989-01-01), Ostrem
"Nondestructive Solder for Thin Metallic Films"--Berry--IBM Technical Disclosure Bulletin--vol. 9, No. 9--Feb. 1967 p. 1071.

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