Electrically powered postage stamp or mailing or shipping label

Communications: directive radio wave systems and devices (e.g. – Radar transponder system – Radar transponder only

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

34082532, 34082554, 342 42, 342 44, G01S 1374

Patent

active

054971403

ABSTRACT:
The present application describes an electronically powered postage stamp or mailing label and including a radio frequency identification (RFID) device and system mounted between the opposing and facing major surfaces thereof. The RFID device and system includes an integrated circuit transceiver chip which is connected to and powered by a thin flat battery cell and is operated with a thin film RF antenna, all of which are mounted in side-by-side relationship on a thin base or support layer. These thin flat components are mounted in an essentially two dimensional planar configuration well suited for incorporation into the planar structure of a postage stamp or a mailing label. In addition, the RFID transceiver chip may be replaced with an electro-optically operated IC chip using, for example, LEDs or laser diodes for the propagation of light signals to an interrogator.

REFERENCES:
patent: 3706094 (1972-12-01), Cole et al.
patent: 3750167 (1973-07-01), Gehman et al.
patent: 3780368 (1973-12-01), Northeved et al.
patent: 3832530 (1974-08-01), Reitbock et al.
patent: 3849633 (1974-11-01), Reitbock et al.
patent: 4049969 (1977-09-01), Salonimer et al.
patent: 4331957 (1982-05-01), Enander et al.
patent: 4399441 (1983-08-01), Vaughn et al.
patent: 4418411 (1983-11-01), Strietzel
patent: 4724427 (1988-02-01), Carroll
patent: 4727560 (1988-02-01), Van Zanten et al.
patent: 4746618 (1988-05-01), Nath et al.
patent: 4756717 (1988-07-01), Sturgis et al.
patent: 4777563 (1988-10-01), Teraoka et al.
patent: 4783646 (1988-11-01), Matsuzaki
patent: 4827110 (1989-05-01), Rossi et al.
patent: 4827395 (1989-05-01), Anders et al.
patent: 4854328 (1989-08-01), Pollack
patent: 4911217 (1990-03-01), Dunn et al.
patent: 4918631 (1990-04-01), Hara et al.
patent: 4942327 (1990-07-01), Watanabe et al.
patent: 4960983 (1990-10-01), Inoue
patent: 4962415 (1990-10-01), Yamamoto et al.
patent: 5023573 (1991-06-01), Adam
patent: 5095240 (1992-03-01), Nysen et al.
patent: 5144314 (1992-09-01), Malmberg et al.
patent: 5148504 (1992-09-01), Levi et al.
patent: 5153710 (1992-10-01), McCain
patent: 5166502 (1992-11-01), Rendleman et al.
patent: 5214410 (1993-05-01), Verster
patent: 5274221 (1993-12-01), Matsubara
patent: 5302954 (1994-04-01), Brooks et al.
patent: 5313211 (1994-05-01), Tokuda et al.
patent: 5337063 (1994-08-01), Takahira
patent: 5414427 (1995-05-01), Gunnarsson
K. Casson et al., "High Temperature Packaging: Flip Chip on Flexible Laminate", Jan. 1992, Surface Mount Technology, pp. 19-20.
R. W. Johnson, "Polymer Thick Films: Technology and Materials", Jul. 1982, Circuits Manufacturing (reprint).
K. Gilleo, "Using SM Devices On Flexible Circuitry", Mar. 1986, Electri-onics, pp. 20-23.
M. G. Kanatzibis, "Conductive Polymers", Dec. 3, 1990, Chemical and Engineering News--American Chemical Society, pp. 36-54.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electrically powered postage stamp or mailing or shipping label does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrically powered postage stamp or mailing or shipping label , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrically powered postage stamp or mailing or shipping label will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1415528

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.