Method of peeling a bonded film from a circuit board

Details Method of peeling a bonded film from a circuit board Method of peeling a bonded film from a circuit board

1990-06-04

1992-05-05

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156584, 406 19, 29DIG78, B32B 3118

Patent

active

051103931

ABSTRACT:
An apparatus for bonding a multi-layer thin film onto a substrate and for removing a layer of the film. A printed circuit board having a multi-layer film bonded to a planar surface thereof has one layer of the film lifted at a leading edge by vibration and fluid pressure. The leading edge is mechanically gripped and a pulling force applied thereto to draw the film from the surface of the circuit board and to transfer the removed film along a path to a discharge apparatus. The transfer apparatus includes frictionally engaged belts which direct the film along a transfer path to a source of ionized fluid which is applied to the film in order to remove static and direct the film along the transfer path towards a used film receptacle.

REFERENCES:
patent: 3071918 (1963-01-01), Hofstetter
patent: 3738592 (1973-06-01), Smith et al.
patent: 4961817 (1990-10-01), Seki
patent: 5000816 (1991-03-01), Seki et al.

Affiliated with

Also associated with

Rating

Method of peeling a bonded film from a circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of peeling a bonded film from a circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of peeling a bonded film from a circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1409968