Interconnection structure for semiconductor integrated circuit a

Details Interconnection structure for semiconductor integrated circuit a Interconnection structure for semiconductor integrated circuit a

1994-03-23

1996-04-09

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257761, 257762, 257770, H01L 2348, H01L 2352, H01L 2940

Patent

active

055064493

ABSTRACT:
An interconnection structure for semiconductor integrated circuits and the method for manufacturing of the same are provided. The interconnection structure has a low electric resistance and a good electromigration resistance and can prevent the atoms in wire materials from diffusing into insulating films or substrates. More particularly, an insulating film 12 is formed on a silicon substrate 10, on which a tungsten 14 is formed. The tungsten film 14 is subjected to plasma irradiation on the surface thereof to form an amorphous W--N film 16. A copper wire pattern 20 is formed on the amorphous W--N film 16.

REFERENCES:
patent: 3906540 (1975-09-01), Hollins
patent: 4141022 (1979-02-01), Sigg et al.
patent: 4829363 (1989-05-01), Thomas et al.
patent: 4980752 (1990-12-01), Jones
patent: 4985750 (1991-01-01), Hoshino
patent: 5132756 (1992-07-01), Matsuda
patent: 5236869 (1993-08-01), Takagi et al.
patent: 5264728 (1993-11-01), Ikeda et al.
patent: 5302552 (1994-04-01), Duchateau
patent: 5341016 (1994-08-01), Prall et al.
patent: 5345108 (1994-08-01), Kikkawa
"IBM Technical Disclosure Bulletin", Method of Fabricating Gold Interconnections With Tantalum-coated Vertical and Horizontal Surfaces.

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