Method for assembling semiconductor devices with lead frame cont

Details Method for assembling semiconductor devices with lead frame cont Method for assembling semiconductor devices with lead frame cont

1993-12-22

1995-03-07

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437209, 437214, 437217, 437220, H01L 2156

Patent

active

053958004

ABSTRACT:
A lead frame for facilitating assembly and interconnection of a plurality of integrated circuit chips comprises a pattern of planar conductors including a surrounding outer connecting strip to which other conductors are temporarily joined, said outer connecting strip having an open end and a closed end. The other conductors comprise a plurality of chip mount conductive areas, each for mounting one of a plurality of chips, disposed in a fan-like arrangement adjacent to the closed end of said outer connecting strip and each connected to said outer connecting strip by a respective tie bar. The other conductors further comprise a plurality of common leads disposed in a semicircular pattern within the fan-like arrangement of the conductive areas, each adapted for connection to selected electrodes of said plurality of chips and a first plurality of parallel external leads drawn out from said common leads arranged in a row, all of said external leads being temporarily connected together and to said outer connecting strip by a common tie bar extending across the open end of said outer connecting strip.

REFERENCES:
patent: 4743956 (1988-05-01), Olla et al.
patent: 4807018 (1989-02-01), Cellai
patent: 5077237 (1991-12-01), Hara
patent: 5079190 (1992-01-01), Mihara
patent: 5202288 (1993-04-01), Doering et al.
patent: 5256598 (1993-10-01), Farnworth et al.
patent: 5258330 (1993-11-01), Khandros et al.

Affiliated with

Also associated with

Rating

Method for assembling semiconductor devices with lead frame cont does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for assembling semiconductor devices with lead frame cont, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for assembling semiconductor devices with lead frame cont will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1405880