Method for forming contact pins for semiconductor dice and inter

Details Method for forming contact pins for semiconductor dice and inter Method for forming contact pins for semiconductor dice and inter

1994-11-07

1996-03-05

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

179260, 257780, 257784, 437 8, H01R 906

Patent

active

054956676

ABSTRACT:
A method for forming contact pins adapted to form an electrical connection with a mating contact location is provided. In a first embodiment, the contact pins are formed on an interconnect used for testing a semiconductor die and are adapted to establish an electrical connection with the bond pads of the die. In a second embodiment, the contact pins are formed directly on the bond pads of a die and can be used for establishing a permanent or temporary electrical connection to the pads. The contact pins include a base portion attached to the die or interconnect, a compliant spring segment, and a contact ball at the tip. The contact pins are formed using a wire bonding process or a welding process in which a metal wire is simultaneously heated and shaped into a compliant structure as it is attached to the die or interconnect.

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