Method of connecting electronic microcomponents

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

29625, 174 685, 317101CC, H05K 330

Patent

active

039810763

ABSTRACT:
A method of connecting electronic microcomponents comprising the steps of realizing a support with conducting wire connecting pads secured on said support, the position of which is adapted to the arrangement of the connections for the microcomponents, making a connecting circuit by sticking an insulated wire onto said support and connecting said conducting wire connecting pads, positioning the microcomponent panels so that each microcomponent connection is in electrical contact with one of said wire connecting pads, welding the connections to their respective wire connecting pads.
A substrate for connecting microcomponents comprising a support on which conducting wire connecting pads are deposited and joined by a connecting circuit made of insulated wire.
A hybrid circuit comprising a number of electronic microcomponents connected by said substrate.

REFERENCES:
patent: 3041504 (1962-07-01), Lacan
patent: 3643133 (1972-02-01), Towell
patent: 3674914 (1972-07-01), Burr
patent: 3701838 (1972-10-01), Olney, Jr.

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