Integrated circuit package

Details Integrated circuit package Integrated circuit package

1976-12-13

1978-02-07

Truhe, J. V.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29626, 339 17CF, 361406, H05K 702

Patent

active

040728161

ABSTRACT:
A prepunched copper/dielectric laminate ground plane assembly is positioned on a metallized ceramic substrate having printed circuits on the surface thereof and provided with a plurality of circuit connection pins. Connection between the ground plane and the circuit connection pins is achieved by welding or soldering of bonding elements between selected pins, which also provides mechanical attachment of the ground plane to the substrate.

REFERENCES:
patent: 3461552 (1969-08-01), Wolf et al.
patent: 3525617 (1970-08-01), Bingham
patent: 3626081 (1971-12-01), Little
patent: 3991347 (1976-11-01), Hollyday
Sopher, "Fluxless Soldering", IBM Technical Disclosure Bulletin; vol. 8, No. 11, Apr. 1966, pp. 1543, 1544.

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