Superconducting power distribution structure for integrated circ

Details Superconducting power distribution structure for integrated circ Superconducting power distribution structure for integrated circ

1989-05-15

1991-10-29

Griffin, Donald A.

Harvesters

361306, 361321, 357 51, H01G 114, H01G 410, H01L 2702, H01B 1200

Patent

active

050616862

ABSTRACT:
A superconducting power distribution structure for integrated circuits characterized by a support member and a relatively thin superconducting capacitor member. Vias extending through the support member and the capacitor member couple power and ground plates of the capacitor member to power and ground traces on the circuit board. The vias are solder-bump connected to an integrated circuit chip, and the entire chip is cryogenically cooled to cause the plates of the capacitor to superconduct. The superconducting capacitor provides a large reservoir of charge to the integrated circuit chip through minimal inductance and with minimal voltage drop across its power plane.

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