Method of making integrated circuit to package electrical connec

Details Method of making integrated circuit to package electrical connec Method of making integrated circuit to package electrical connec

1990-07-18

1991-10-29

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437211, H01L 2156, H01L 2152, H01L 2160, H01L 2158

Patent

active

050616579

ABSTRACT:
A method of making electrical connections between integrated circuit contacts (16) and package contacts (18) which are more reliable and less expensive to produce is disclosed. First, an integrated circuit (10) is positioned in the cavity (12) of a package (14). Then the contacts (16) of the integrated circuit (10) and the contacts (18) of the package (14) are covered with a layer of a non-conducting organic polymer (20). Finally, a conductive path (22) is formed between the contacts (16) of the integrated circuit (10) and the contacts (18) of the package (14). Any suitable non-conductive organic polymer (20) can be used including polyaniline, polypyrrole, polythiophene, polyacetylene, poly(p-phenylene-sulfide) and poly(2,6-dimethylphenylene-oxide). The non-conducting organic polymer (20) can be applied by any suitable technique including application as a pre-formed film, deposition by electrochemical methods or deposition by low pressure chemical vapor deposition. The polymer (20) can even be applied as a solvent reduced solution with subsequent evaporation of the solvent (curing). The conductive path ( 22) can be formed in the layer of non-conducting polymer (20) by any suitable method including chemical doping, focused ion beam doping, and direct ion beam doping. The device may be protected by additional layers of non-conducting polymer (24) and a cover (26).

REFERENCES:
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Alper, Joseph, "Sparks Return for Intractable Materials", Chemistry & Indry, Nov. 20, 1989, pp. 746-747.

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