Semiconductor polishing pad

Abrading – Abrading process – Side face of disk

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

451 41, 451548, B24B 704

Patent

active

053946553

ABSTRACT:
The invention is to a polishing pad 14 that has a polishing surface 19 in which portions 17 and 18 of the polishing surface 19 have been removed. The removed areas 17 and 18 are annular rings adjacent an outer 15 and inner 16 edges of the polishing pad 14. The non-polishing surfaces 18 and 19 taper 17a and 18a downward from the polishing surface 19.

REFERENCES:
patent: 1622942 (1927-03-01), Chase
patent: 5177908 (1993-01-01), Tuttle
patent: 5243790 (1993-09-01), Gagne

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor polishing pad does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor polishing pad, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor polishing pad will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1399105

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.