Reduced fat shredded wafers and process

Details Reduced fat shredded wafers and process Reduced fat shredded wafers and process

1996-12-17

1998-06-23

Paden, Carolyn

Food or edible material: processes, compositions, and products

Surface coated, fluid encapsulated, laminated solid...

Isolated whole seed, bean or nut, or material derived therefrom

426309, 426620, A23L 1168

Patent

active

057702489

ABSTRACT:
Reduced fat, low-fat, or no-fat shredded whole grain wafers or biscuits are produced which exhibit a non-gritty smooth or a slippery mouthfeel and glossy appearance even though the fat content is substantially reduced. In embodiments of the invention, at least a substantial portion of the shortening or fat which is topically applied to a baked, shredded product is replaced with a hydrocolloid gum, preferably guar gum. The gum may be incorporated into the product prior to shredding of whole berries or grains. The gum composition, preferably in substantially dry, particulate, or powdered form may be blended with cooked berries or grains to obtain discrete, shreddable, free-flowing gum coated berries or grains. The hydrocolloid gum may be hydrated by the cooked berries or grains upon admixing so as to achieve adhesion of the dry, particulate, or powdered gum to the surface of the grains or berries. The discrete, gum coated berries or grains may be continuously formed into layers of strands or integral net-like sheets which may be continuously laminated. The laminates may be cut to form pieces which are baked to obtain shelf stable wafers or biscuits. Shortening or fat may, for example, be applied to the baked product by spraying in amounts which result in a fat content of less than about 12% by weight.

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