Method of manufacturing a ceramic electronic component

Details Method of manufacturing a ceramic electronic component Method of manufacturing a ceramic electronic component

1996-11-20

1998-06-23

Fiorilla, Christopher A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

264620, 427125, C04B 3700, B05D 512

Patent

active

057699887

ABSTRACT:
A method of manufacturing a ceramic electronic component having a dielectric ceramic and a conductor containing Ag as a main component, wherein a dielectric resonator with a high Q value is produced by heat treating at 400.degree. C. or more in an atmosphere containing 10% or less by volume of oxygen after sintering the dielectric ceramic. Using a BaO--TiO.sub.2 --Nd.sub.2 O.sub.3 --Bi.sub.2 O.sub.3 based composition (.epsilon..sub.r =92, Qf=5000 GHz) as a dielectric, a coaxial type dielectric ceramic is produced by granulating calcined powder of the dielectric and then compacting the powder, followed by sintering. A dielectric resonator of .lambda./4 is produced by coating the dielectric ceramic with Ag paste at a position other than either the upper or lower side and then burning the paste. Thereafter, the electrodes(1,4) are formed by burning the paste at 400.degree. C. or more in an atmosphere containing 10% or less by volume of oxygen. The coaxial type dielectric resonator accepts electromagnetic waves from the open end and obtains output by utilizing TEM mode.

REFERENCES:
patent: 4795670 (1989-01-01), Nishigaki et al.
patent: 4977485 (1990-12-01), Mori et al.

Affiliated with

Also associated with

Rating

Method of manufacturing a ceramic electronic component does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a ceramic electronic component, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a ceramic electronic component will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1391296