Heated plate rapid thermal processor

Metal working – Barrier layer or semiconductor device making – Barrier layer device making

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Details

118716, 118720, 118725, C23C 1600, C23C 1646

Patent

active

050603540

ABSTRACT:
A rapid thermal processor for heat treating and cooling semiconductor material is an elongated process chamber having a base, side and top walls which enclose a heater plate assembly through which thin pins longitudinally move to carry workpieces vertically to and from the heater assembly. A cooling shutter is adapted in the chamber to shield the workpiece from the heater plate when the cooling process takes place. The chamber has gaseous ambient control means which regulates the type of atmosphere or vacuum in the chamber during heat processing of the workpiece.

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A New VLSI Compat. Rapid Therm. Proc. 545, pp. 622-626 Aitken et al. (1987).

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