Semiconductor device package with shaped parts for direct coupli

Details Semiconductor device package with shaped parts for direct coupli Semiconductor device package with shaped parts for direct coupli

1995-05-02

1997-01-14

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257692, 257697, 437620, H01L 2348, H01L 2941

Patent

active

055942768

ABSTRACT:
A packaging structure is disclosed for a semiconductor device, having a body configured to include at least one part provided with some terminating rheophores and shaped to form a connector member for direct coupling to a standard connector member from an external circuit. A connector assembly is also disclosed which is fully sealed from moisture and comprises the packaging structure. The invention has an advantageous application in the field of electric systems for motor vehicles.

REFERENCES:
patent: 3368116 (1968-02-01), Spaude
patent: 4208698 (1980-06-01), Narasimhan
patent: 4239319 (1980-12-01), Gladd et al.
patent: 4675718 (1987-06-01), Tsubokura et al.
patent: 4985310 (1991-01-01), Agarwala et al.
patent: 5108300 (1992-04-01), Weber
patent: 5198963 (1993-03-01), Gupta et al.
patent: 5412248 (1995-05-01), Murai et al.

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