Methods and apparatus for the chemical mechanical planarization

Details Methods and apparatus for the chemical mechanical planarization Methods and apparatus for the chemical mechanical planarization

1996-06-14

1998-06-23

Morgan, Eileen P.

Abrading

Abrading process

Glass or stone abrading

451287, 451533, 451526, B24B 700

Patent

active

057696918

ABSTRACT:
A non-cellular lapping pad is employed in a chemical mechanical planarization machine in conjunction with a polishing slurry to planarize the surface of a silicon workpiece. Planarization is effected by pressing the workpiece against the pad and moving the pad relative to the workpiece in at least one direction. The pad may be constructed of a porous material capable of adsorbing and entraining the slurry, such as fused polyethylene or non-cellular urethane. The pad may also be constructed may be made of a soft material to avoid damage to integrated circuit devices present on the surface of the silicon workpiece, such as a flexibilized epoxy. The slurry is a chemically and mechanically active solution comprising abrasive particles coupled with chemically reactive agents. The abrasive particles have a size of 10-200 nanometers, and suitable particle materials include colloidal silica, cerium oxide and alumina. The chemically reactive agents comprise 5-20% by weight of the solution, and suitable agents include hydroxides and potassium fluoride.

REFERENCES:
patent: 4805348 (1989-02-01), Arai et al.
patent: 5069002 (1991-12-01), Sandhu et al.
patent: 5099614 (1992-03-01), Arai et al.
patent: 5329732 (1994-07-01), Kalsrud et al.
patent: 5435772 (1995-07-01), Yu
patent: 5486129 (1996-01-01), Sandhu et al.
patent: 5489233 (1996-02-01), Cook et al.
patent: 5498196 (1996-03-01), Kalsrud et al.
patent: 5498199 (1996-03-01), Karlsrud et al.
patent: 5534106 (1996-07-01), Cote et al.
patent: 5536202 (1996-07-01), Appel et al.

Affiliated with

Also associated with

Rating

Methods and apparatus for the chemical mechanical planarization does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods and apparatus for the chemical mechanical planarization , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and apparatus for the chemical mechanical planarization will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1389085