Plating apparatus

Details Plating apparatus Plating apparatus

1981-10-16

1985-02-12

Hearn, Brian E.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204 23, 204297R, 204225, C25D 704, C25D 702, C25D 312

Patent

active

044989652

ABSTRACT:
A plating apparatus for plating an annular diaphragm member which includes a first lower member including a first vertical passage formed therein having an opening, an outlet port in fluid communication with the first vertical passage, and a surface formed around the upper opening for mounting the annular member thereon, a second, upper member detachably mounted on the first member so as to form a casing, the second member including a second vertical passage formed therein having a lower opening opposed to the upper opening, and an inlet port in fluid communication with the second vertical passage, the lower opening having a larger radius than that of the upper opening, a positive electrode positioned above an upper inner peripheral portion of the annular member, a mechanism for supplying plating fluid under pressure to the inlet port, a control mechanism for controlling current distribution from the positive electrode to the upper inner peripheral portion of the annular member and a negative electrode electrically connected to the annular member wherein plating fluid is supplied to the inlet port under pressure and is discharged from the outlet port.

REFERENCES:
patent: 3464910 (1969-09-01), Krebs et al.
patent: 3751346 (1973-08-01), Ellis et al.
patent: 3891515 (1975-06-01), Paulson et al.
patent: 4096042 (1978-09-01), Looney et al.
patent: 4246088 (1981-01-01), Murphy et al.

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