Process for making a multileveled electronic package

Details Process for making a multileveled electronic package Process for making a multileveled electronic package

1995-05-23

1997-01-14

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427316, 4273722, 427379, 427384, 4274071, 29846, 29855, 428901, B05D 512

Patent

active

055937209

ABSTRACT:
A multilevel electronic package comprising at least two levels, each level including a poly(aryl ether benzimidazole), a polymide and copper. A process of preparing this package is disclosed. Several novel poly(aryl ether benzimidazoles) useful in preparing this package are also set forth.

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