Flexible thermal conduction element for cooling semiconductor de

Details Flexible thermal conduction element for cooling semiconductor de Flexible thermal conduction element for cooling semiconductor de

1981-08-03

1985-02-12

Davis, Jr., Albert W.

Heat exchange

Heat transmitter

165 80B, 165 80C, 357 82, 361386, F28F 700

Patent

active

044985304

ABSTRACT:
A flexible, extensible thermal conduction element for use in a semiconductor package to conduct heat from a device to a cold plate, or cover, featuring a plurality of thin flexible interleaved leaf elements capable of bridging the gap between the device and cold plate, or cover, and accommodating for gap variability and non-parallel surfaces.

REFERENCES:
patent: 4226281 (1980-10-01), Chu
patent: 4235283 (1980-11-01), Gupta
patent: 4263965 (1981-04-01), Mansuria et al.
Dombroski, et al. IBM TDB, vol. 19, No. 12, May 1977, p. 4683.

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