Tab tape and semiconductor device using the tab tape

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Patent

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Details

257752, H01L 2348

Patent

active

058922776

ABSTRACT:
In a TAB tape, dummy copper foil patterns are provided on the portions of an adhesive on which neither pads nor leads are provided, thereby flattening the upper surface of solder resist coated on the resultant structure.

REFERENCES:
patent: 4916514 (1990-04-01), Nowak

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