IC package and IC card incorporating the same thereinto

Details IC package and IC card incorporating the same thereinto IC package and IC card incorporating the same thereinto

1990-08-07

1991-11-19

James, Andrew J.

357 80, 357 72, 357 14, 357 77, H01L 2302

Patent

active

050670085

ABSTRACT:
An IC package comprising an integrated substrate which includes a cavity, in which an IC chip is mounted, formed by a wall surrounding the IC chip, and a groove formed in the surrounding wall extending to surround and communicate with the cavity and method for fabricating the IC package, wherein an excessive amount of resin is filled in the cavity of the integrated substrate, and the composite structure pressed by a plate whereby the excess of the resin overflows from the cavity pressure to be received in the groove such that, the exposed surface of the filled resin is formed into a predetermined shape without requiring grinding.

REFERENCES:
patent: 3381071 (1968-04-01), Logan et al.
patent: 4822989 (1990-04-01), Miyamoto et al.
patent: 4825282 (1989-04-01), Fukaya
patent: 4954308 (1990-09-01), Yabe et al.
Patent Abstracts of Japan, vol. 9, no. 325 (E-368) (2048), Dec. 20, 1985; and JP-A-jo-157 241 (Mitsubishi) 18-[-1985.
Patent Abstracts of Japan, vol. 12, no. 65 (E-586) (2912), Feb. 27, 1988; and JP-A-62-208 651 (Mitsubishi) 12-09-1987.

Affiliated with

Also associated with

Rating

IC package and IC card incorporating the same thereinto does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with IC package and IC card incorporating the same thereinto, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and IC package and IC card incorporating the same thereinto will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1373944