1991-03-26
1991-11-19
Wojciechowicz, Edward J.
357 51, 357 70, 357 81, H01L 2328
Patent
active
050670050
ABSTRACT:
A semiconductor device having a heat radiating member and a laminated structure for improvements in electrical and heat radiating characteristics. The heat radiating member is partially exposed outside a resin package of the semiconductor device to radiate heat generated by a semiconductor element to the outside of the device. In the laminated structure, a capacitor having a small capacity is formed by two electrically conductive plates one of which is connected to power supply leads and the other of which is connected to a grounded portion of the semiconductor element and to a grounding lead.
REFERENCES:
patent: 4714952 (1987-12-01), Takekawa et al.
patent: 4823234 (1989-04-01), Konishi et al.
patent: 4835120 (1989-05-01), Mallik et al.
"Nikkei Microelectronics", Jun. 1989, pp. 103-109.
Andrews, "Thermal Characteristics . . . DIP's", IEEE, vol. CHMT, No. 4, 1981, pp. 455-460.
Michii Kazunari
Takehara Masataka
Mitsubishi Denki & Kabushiki Kaisha
Wojciechowicz Edward J.
LandOfFree
Semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1373905