Structure of and method for manufacturing an LED

Fishing – trapping – and vermin destroying

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437127, 437183, 437905, H01L 3300

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active

054728860

ABSTRACT:
An LED has both its p and n bonding pads on the p side of the wafer for simultaneous solder bump alignment and electrical connection of the LED with a device carrier. A groove is formed dividing the p material of the device into an active region and an inactive region. The groove also provides a path for the device's n-contact, which extends from the n-material at the base of the groove, up the side of the groove, to the n bonding pad on the surface of the inactive p material.

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