Apparatus for and method of polishing workpiece

Details Apparatus for and method of polishing workpiece Apparatus for and method of polishing workpiece

1996-10-09

1999-06-29

Kunemund, Robert

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

438693, 216 38, 216 88, 216 89, 451 41, 51309, H01L 21306

Patent

active

059164123

ABSTRACT:
A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring for holding a workpiece and pressing the workpiece against the abrasive cloth under a first pressing force to polish the workpiece. The top ring has a recess defined therein for accommodating the workpiece therein. A presser ring is vertically movably disposed around the top ring, and pressed against the abrasive cloth under a variable second pressing force. The first and second pressing forces are variable independently of each other, and the second pressing force is determined based on the first pressing force.

REFERENCES:
patent: 4954142 (1990-09-01), Carr et al.
patent: 5205082 (1993-04-01), Shendon et al.
patent: 5584751 (1996-12-01), Kobayashi et al.
patent: 5635083 (1997-06-01), Breivogel et al.
patent: 5645474 (1997-07-01), Kubo et al.
Concurrently Filed U.S. Application, Norio Kimura et al., entitled "Apparatus for and Method of Polishing Workpiece", Atty. Docket No. 1213/GEB361 US.

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