Process for producing an electrically conductive connection

Details Process for producing an electrically conductive connection Process for producing an electrically conductive connection

1995-06-27

1999-06-29

Stemmer, Daniel

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29739, 156232, 156235, H01R 404, H05K 1304

Patent

active

059164077

DESCRIPTION:

BRIEF SUMMARY
BACKGROUND OF THE INVENTION

The invention relates to a process for producing an electrically conductive connection between opposite arranged contact areas of two elements that must be connected using a hot-melt type adhesive with electrically conductive particles that are dispersed in a thermoplastic base material.


PRIOR ART

The production of electrically conductive connections between two elements with the aid of an electrically conductive hot-melt type adhesive is known, wherein here the term elements is understood to include, for example, electronic components, integrated circuits, printed circuits or the like, which have contact areas that are exposed on the surface area of the elements and are to be contacted. The electrically conductive hot-melt type adhesives have electrically conductive particles that are dispersed in a thermoplastic base material and which take over the electrically conductive connection between the contact areas of the elements to be connected. The contact areas in this case are joined under pressure and the effects of heat and by inserting the hot-melt type adhesive, so that the electrically conductive particles make contact with the respective contact areas and thus form an electrically conductive path. A disadvantage of the known processes is that the hot-melt type adhesive must be applied over a large surface, that is several adjoining contact areas, so that undesired short circuits between neighboring contacting areas can occur during the contacting of the elements via the conductive particles. Owing to this, only contacting areas with a relatively low resolution, that is a relatively large distance to each other, can be connected electrically conductive.


SUMMARY AND ADVANTAGES OF THE INVENTION

The above object generally is achieved according to the present invention by a process for producing an electrically conductive connection between opposite arranged contact areas of two elements that must be connected, by means of a hot-melt type adhesive with electrically conductive particles that are dispersed in a thermoplastic base material, wherein the hot-melt type adhesive is purposely applied only to the contact areas of at least one of the elements, and these elements are joined under the effects of heat to form the connections.
The above described process according to the invention, offers the advantage that contacting areas with a relatively small distance to each other, that is with a high resolution, can be contacted safely, without short circuits occurring between neighboring contacting areas. Owing to the fact that the hot-melt type adhesive is applied purposely only to the contact areas of at least one of the elements, it is advantageously possible to avoid wetting the areas between two neighboring contact areas of an element that are to be contacted with the hot-melt type adhesive. Thus, in these areas the electrically conductive particles, which are dispersed in the hot-melt type adhesive, cannot establish any lateral connections between the contact areas.
An advantageous embodiment of the invention provides that the areas between the contact areas are provided with a lyophobic layer, so that on the one hand a wetting of these areas through flowing hot-melt type adhesive is avoided during the application of the hot-melt type adhesive to the contact areas and, on the other hand, the hot-melt type adhesive while it is melting cannot wet these areas during the joining process of the two elements. Within the framework of the invention, a lyophobic layer generally is understood to be a fluid-rejecting layer or a layer that cannot be wetted with fluid.
In another advantageous embodiment of the invention, it is provided that the hot-melt adhesive applied to the contact areas is plastically patterned in such a way that structures result, which permit a self-adjustment of the elements during the joining process. This reduces a positioning expenditure for the situation-oriented positioning of two elements that are to be connected electrically conductive because the sele

REFERENCES:
patent: 4231830 (1980-11-01), Ryan
patent: 4353977 (1982-10-01), Gerbes
patent: 4731503 (1988-03-01), Kitanishi
patent: 4829663 (1989-05-01), Masujima

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