Method of transferring target substrates in semiconductor proces

Details Method of transferring target substrates in semiconductor proces Method of transferring target substrates in semiconductor proces

1998-03-30

1999-06-29

Walberg, Teresa

Heating

Processes of heating or heater operation

Including preparing or arranging work for heating

414937, 414804, 414811, 414416, 432241, F27D 500, F27D 1300

Patent

active

059159570

ABSTRACT:
Semiconductor wafers are transferred from a closed type cassette into a wafer boat. First, the lowermost five wafers of 13 wafers held in the cassette are simultaneously transferred by five arms from the cassette into the uppermost part of the wafer boat. Then, the lowermost three wafers among the wafers left in the cassette are simultaneously transferred by the upper three arms from the cassette into the boat immediately under the five wafers previously transferred. Further, the uppermost five wafers left in the cassette are simultaneously transferred by the five arms from the cassette into the boat immediately under the eight wafers previously transferred.

REFERENCES:
patent: 5217340 (1993-06-01), Harada et al.

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