Metal working – Method of mechanical manufacture – Electrical device making
Patent
1997-10-17
1999-06-29
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
257668, 257669, 257773, 3241581, H01R 900
Patent
active
059157550
ABSTRACT:
A method for forming an interconnect for establishing electrical communication with a semiconductor die is provided. The method includes: providing a microbump tape and then mounting the tape to a substrate with a compliant layer therebetween. The microbump tape includes an insulating film having a pattern of microbump contact members corresponding to a pattern of bond pads on the die. The compliant layer can be formed of a curable adhesive such as a silicone elastomer. A coupon containing a plurality of microbump tapes can be mounted to a substrate wafer which can then be singulated to form a plurality of interconnects. The interconnects can be used with a testing apparatus for testing unpackaged semiconductor dice.
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Farnworth Warren M.
Gochnour Derek
Arbes Carl J.
Gratton Stephen A.
Micro)n Technology, Inc.
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