Structure for microelectronic device incorporating low resistivi

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257751, 257757, 257764, 257767, 257770, 257774, 257635, H01L 2348

Patent

active

054752663

ABSTRACT:
A microelectronic device (10) provides decreased use of bar area to form contacts between a conductive strap (24) or interconnect and subsequent levels. The conductive strap comprises a conducting layer (130) and an overlying semiconducting layer (132). Connection to subsequent levels is made generally overlying substrate conductive areas such as a gate (14) and/or a moat (16). Connection to conductive sublayer (130) is accomplished by doping an overlying semiconductor sublayer (132). Any counter-doping of substrate conductive areas is blocked by an overlying well of dopant-masking (33) or sufficiently thick semiconducting (32) material.

REFERENCES:
patent: 4866009 (1989-09-01), Matsuda
patent: 4874719 (1989-10-01), Kurosawa
patent: 4884123 (1989-11-01), Dixit et al.
patent: 5079617 (1992-01-01), Yoneda

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Structure for microelectronic device incorporating low resistivi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Structure for microelectronic device incorporating low resistivi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Structure for microelectronic device incorporating low resistivi will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1362028

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.