Vertical contact structure

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

357 71, 357 59, 357 65, H01L 2348

Patent

active

049145010

ABSTRACT:
A compact vertical contact has lateral space requirements in the fabrication of semiconductor devices and is compatible with highly planarized processes. The contact is made from a foundation region having a top surface to an overlying layer separated from the foundation region by a dielectric. The overlying layer may be contacted at an edge rather than on its top surface in order to reduce the lateral expanse of the contact.

REFERENCES:
patent: 4374700 (1983-02-01), Scott et al.
patent: 4507171 (1985-03-01), Bhatia et al.
patent: 4619037 (1986-10-01), Taguchi et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Vertical contact structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Vertical contact structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Vertical contact structure will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1361543

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.