1989-04-06
1990-04-03
James, Andrew J.
357 71, 357 59, 357 65, H01L 2348
Patent
active
049145010
ABSTRACT:
A compact vertical contact has lateral space requirements in the fabrication of semiconductor devices and is compatible with highly planarized processes. The contact is made from a foundation region having a top surface to an overlying layer separated from the foundation region by a dielectric. The overlying layer may be contacted at an edge rather than on its top surface in order to reduce the lateral expanse of the contact.
REFERENCES:
patent: 4374700 (1983-02-01), Scott et al.
patent: 4507171 (1985-03-01), Bhatia et al.
patent: 4619037 (1986-10-01), Taguchi et al.
Rivoli Anthony L.
Young William R.
Harris Corporation
James Andrew J.
Prenty Mark
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