Method of forming flexible metal leads on integrated circuits

Details Method of forming flexible metal leads on integrated circuits Method of forming flexible metal leads on integrated circuits

1990-11-05

1991-11-19

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29879, 29 33M, 72337, 723792, 140105, 357 79, H01R 4300, B23P 2500

Patent

active

050655043

ABSTRACT:
Slide forming tape-automated-bonded leads extending from an integrated circuit chip with a support ring on the leads between the outer periphery of the chip and the outer lead ends. After the leads are formed the support ring remains attached to the vertical portion of the leads opposite the chip. The present invention is well suited for minimizing and footprint on relatively long TAB leads which fan out and require a support ring to maintain proper lead pitch.

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"Comparative Compliance of Generic Lead Designs for Surface Mounted Components", by Robert W. Kotlowitz, AT&T Bell Laboratories, Whippany, N.J., 07981, pp. 7-19.

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