Process for correcting warped surface of plastic encapsulated se

Details Process for correcting warped surface of plastic encapsulated se Process for correcting warped surface of plastic encapsulated se

1993-08-02

1996-02-20

Wilczewski, Mary

Fishing, trapping, and vermin destroying

437212, 437214, 437216, 437248, 437249, 437923, H01L 2156, H01L 21603, H01L 2168, H01L 2170

Patent

active

054928664

ABSTRACT:
A process for correcting the warped surface of a plastic encapsulated semiconductor lead frame device. The semiconductor device is placed on a transporting plate and transported to a heating device. The semiconductor device and the transporting device are clamped between a pair of heating plates and heated. Then the semiconductor device and the transporting plate are removed from the device and clamped between a pair of cooling plates and cooled. The warp is corrected to a substantially flat surface.

REFERENCES:
patent: 4863547 (1989-09-01), Shidahara et al.
patent: 5132779 (1992-07-01), Osada et al.
patent: 5297480 (1994-03-01), Miyashita et al.

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