Wire bonder and wire bonding method

Details Wire bonder and wire bonding method Wire bonder and wire bonding method

1994-03-29

1995-12-12

Ramsey, Kenneth J.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228 9, 2281805, H01L 2160

Patent

active

054742242

ABSTRACT:
The present invention provides an apparatus and its method that is able to effectively use positional data such as coordinates and so forth stored in advance in a bonder.
A first or second bonding point in the form of bonded sites is photographed by a camera based on commands from a control device, and inspection is performed as to whether a bonded indentation is present within a specified range at a location specified in advance and/or centering on said location.

REFERENCES:
patent: 5145099 (1992-09-01), Wood et al.
patent: 5356065 (1994-10-01), Kobayashi

Affiliated with

Also associated with

Rating

Wire bonder and wire bonding method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wire bonder and wire bonding method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wire bonder and wire bonding method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1355180