Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent
1991-03-21
1993-10-19
Pascal, Robert J.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
257763, 257767, 257486, H01L 2348
Patent
active
052548724
ABSTRACT:
A semiconductor device having a reliable contact is disclosed. The device includes a barrier film deposited on the bottom and side wall of a contact hole opened in a insulating film at a predetermined position; a first metal film filled in the contact hole; and a second metal film of low resistance for forming an interconnection which passes above the contact hole filled in with the first metal film. An oxide film is formed by oxidation on the barrier metal film. And a method of manufacturing the semiconductor device is disclosed. The method includes the steps of: after opening a contact hole at a predetermined position in an insulating film deposited on a semiconductor substrate, forming a barrier film in the bottom and side wall of the contact hole; filling the contact hole with a first metal film while heating the semiconductor substrate at a predetermined temperature; and depositing a second metal film over the surface of the semiconductor device and patterning the second metal film to form an interconnection which passes the contact hole that has been filled in with the first metal film.
REFERENCES:
patent: 4556897 (1985-12-01), Yorikane
patent: 4910580 (1990-03-01), Kuecher
patent: 4980734 (1990-12-01), Inoue
patent: 5070364 (1991-10-01), McCollum
Okumura Katsuya
Watanabe Tohru
Yoda Takashi
Kabushiki Kaisha Toshiba
Pascal Robert J.
Ratliff R. A.
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